Assignment of Assignor's Interest

Recorded: 2006-10-25 Pages: 3

Assignor

CHA, KI-SEOK

Executed: 2006-10-09

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Driving Chip Package, Display Device Including the Same, and Method of Testing Driving Chip Package

Patent: 7,746,093 →

Application: 11/586,206 →

Publication: US 2007/0182440

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.