Patent Assignment
Reel/Frame 018506/0053
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2006-11-10
Received: 2006-11-10
Pages: 3
Assignor
TAY, LIONEL CHIEN HUI
Executed: 2006-10-20
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Application
(1)
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK
App. No. 11/558,404
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