Patent Assignment
Reel/Frame 018506/0145
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2006-11-10
Received: 2006-11-10
Pages: 5
Assignors
BATHAN, HENRY D.
Executed: 2006-10-31
DIMAANO, ANTONIO B., JR.
Executed: 2006-10-31
PUNZALAN, JEFFREY D.
Executed: 2006-10-31
SHIM, IL KWON
Executed: 2006-10-31
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Application
(1)
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEAT SINK
App. No. 11/558,413
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