Patent Assignment
Reel/Frame 018555/0756
Assignment of Assignor's Interest
Recorded: 2006-11-28
Received: 2006-11-28
Pages: 2
Assignors
MORI, MASATO
Executed: 2006-09-04
HIRANO, MASATO
Executed: 2006-09-06
NISHIDA, KAZUTO
Executed: 2006-09-25
ONISHI, HIROAKI
Executed: 2006-10-18
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, JPX, 571-8501, JAPAN
Covered Property
(1)
Electronic component mounting method, and circuit substrate and circuit substrate unit used in the method
Application:
10/597,949 →