Patent Assignment
Reel/Frame 018571/0054
Assignment of Assignor's Interest
Recorded: 2006-12-01
Received: 2006-12-01
Pages: 4
Assignors
AMIN, AMAR
Executed: 2006-11-20
AWUJOOLA, ABIOLA
Executed: 2006-11-20
CHIA, CHOK J
Executed: 2006-11-20
FISHLEY, CLIFFORD
Executed: 2006-11-20
MORA, LEONARD
Executed: 2006-11-20
OTHIENO, MAURICE
Executed: 2006-11-21
Assignee
LSI LOGIC CORPORATION
1621 BARBER LANE, MILPITAS, CA, 95035, UNITED STATES
Covered Property
(1)
Wire Bond Integrated Circuit Package for High Speed I/O
Application:
11/565,701 →