Patent Assignment
Reel/Frame 018577/0176
Assignment of Assignor's Interest
Recorded: 2006-11-30
Pages: 6
Assignor
KARMAZYN, MICHAEL J.
Executed: 2005-12-28
Assignee
AAI CORPORATION
P.O. BOX 126, HUNT VALLEY, MARYLAND, 21030-0126
Covered Property
(1)
Method of angular encapsulation of tandem stacked printed circuit boards
Application:
60/741,447 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.