Patent Assignment
Reel/Frame 018609/0704
Assignment of Assignor's Interest
Recorded: 2006-11-21
Received: 2006-11-29
Pages: 3
Assignor
PRASIT SRICHAROENCHAIKIT
Executed: 2006-11-20
Assignee
M/A-COM, INC.
1011 PAWTUCKET BOULEVARD, LOWELL, MA, 01854, UNITED STATES
Covered Properties
(2)
System and method for solder bump plating
Application:
11/602,736 →
Configurable System for Performing Repetitive Actions
Application:
11/599,106 →