Patent Assignment
Reel/Frame 018615/0601
Assignment of Assignor's Interest
Recorded: 2006-11-27
Pages: 3
Assignee
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU, TOKYO, 103-8272, JAPAN
Covered Property
(1)
Multilayer Circuit Board and Method for Manufacturing the Same