IP Library › Assignment 018634/0713
Patent Assignment
Reel/Frame 018634/0713

Assignment of Assignor's Interest

Recorded: 2006-12-14 Pages: 4
Assignors
TAKEMURA, KOJI
Executed: 2006-08-09
HIRANO, HIROSHIGE
Executed: 2006-08-09
TAKAHASHI, MASAO
Executed: 2006-08-09
SANO, HIKARI
Executed: 2006-08-09
ITOH, YUTAKA
Executed: 2006-08-09
KOIKE, KOJI
Executed: 2006-08-09
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Semiconductor Device Having Pads and Which Minimizes Defects Due to Bonding Adn Probing Process
Patent: 8,102,056 →
Application: 11/511,306 →
Publication: US 2007/0052068
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 24, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0689 →
Assignment of Assignor's Interest Mar 31, 2026
From: PANASONIC HOLDINGS CORPORATION
To: NUVOTON TECHNOLOGY CORPORATION JAPAN
Reel/Frame 074237/0726 →