Assignment of Assignor's Interest

Recorded: 2006-12-21 Pages: 4

Assignor

KIM, SANG CHUL

Executed: 2006-12-20

Assignee

DONGBU ELECTRONICS CO., LTD.

891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF

Covered Property (1)

Method of Forming Copper Interconnections in Semiconductor Devices

Application: 11/614,713 →

Publication: US 2007/0151859

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.