Patent Assignment
Reel/Frame 018673/0804
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2006-12-22
Received: 2006-12-22
Pages: 4
Assignors
JEON, HYUNG JUN
Executed: 2006-12-04
KO, YOUNG CHAN
Executed: 2006-12-04
LEE, TAE KEUN
Executed: 2006-12-04
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Application
(1)
SEMICONDUCTOR WAFER SCALE PACKAGE SYSTEM
App. No. 11/615,923
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