IP Library Assignment 018673/0808
Patent Assignment
Reel/Frame 018673/0808

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2006-12-22 Received: 2006-12-22 Pages: 3
Assignors
LEE, SANG-HO
Executed: 2006-12-21
LEE, TAEWOO
Executed: 2006-12-21
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Application (1)
WAFER SYSTEM WITH PARTIAL CUTS
App. No. 11/615,929