IP Library › Assignment 018689/0742
Patent Assignment
Reel/Frame 018689/0742

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2006-12-28 Received: 2006-12-28 Pages: 5
Assignors
BAE, JOHYUN
Executed: 2006-12-27
HA, JONG-WOO
Executed: 2006-12-27
LEE, SEONGMIN
Executed: 2006-12-27
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Application (1)
MOUNTABLE INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH ADHESIVE SPACING STRUCTURES
App. No. 11/617,413
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