Patent Assignment
Reel/Frame 018698/0379
Assignment of Assignor's Interest
Recorded: 2007-01-02
Pages: 3
Assignors
SHIH, CHIEN-HSUEH
Executed: 2006-11-22
TSAI, MINGHSING
Executed: 2006-11-22
YU, CHEN-HUA
Executed: 2006-11-22
YEH, MING-SHIH
Executed: 2006-11-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Process for Improving Copper Line Cap Formation