Patent Assignment
Reel/Frame 018708/0148
Assignment of Assignor's Interest
Recorded: 2006-12-14
Received: 2006-12-19
Pages: 2
Assignor
YOSHIDA, YUICHI
Executed: 2006-10-26
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Semiconductor apparatus containing multi-chip package structures
Application:
11/638,477 →