IP Library › Assignment 018714/0493
Patent Assignment
Reel/Frame 018714/0493

Assignment of Assignor's Interest

Recorded: 2006-12-26 Pages: 4
Assignors
LOO, KUM-WENG
Executed: 2006-12-06
KHO, CHEK-LIM
Executed: 2006-12-06
LUAN, JING-EN
Executed: 2006-12-06
Assignee
STMICROELECTRONICS ASIA PACIFIC PTE., LTD.
5A SERANGOON NORTH AVENUE 5, SINGAPORE, 554574, SINGAPORE
Covered Property (1)
Semiconductor Package with Position Member
Patent: 7,745,945 →
Application: 11/545,814 →
Publication: US 2007/0085177
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0215 →