Patent Assignment
Reel/Frame 018724/0261
Assignment of Assignor's Interest
Recorded: 2006-12-20
Pages: 3
Assignors
ENOMOTO, RYO
Executed: 2006-10-03
OHMI, TADAHIRO
Executed: 2006-11-06
MORIMOTO, AKIHIRO
Executed: 2006-10-18
Assignees
IBIDEN CO., LTD.
1, KANDA-CHO 2-CHOME, OGAKI-SHI, GIFU 503-8604, JAPAN
NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY
1-1, KATAHIRA, 2-CHOME, AOBA-KU, SENDAI-SHI, MIYAGI 980-8577, JAPAN
Covered Property
(1)
A Multilayered Circuit Substrate with Semiconductor Device Incorporated Therein