Patent Assignment
Reel/Frame 018746/0040
Security Interest
Recorded: 2007-01-09
Received: 2007-01-10
Pages: 10
Assignor
POLYCLAD LAMINATES, INC.
Executed: 2006-12-18
Assignee
GOLDMAN SACHS CREDIT PARTNERS L.P., AS COLLATERAL AGENT
30 HUDSON ST., 17TH FLOOR, C/O GOLDMAN SACHS & CO., JERSEY CITY, NJ, 07302, UNITED STATES
Covered Properties
(9)
Flame Retardant Compositions with a Phosphorated Compound
Application:
11/269,132 →
Stacked Microelectronic Layer and Module with Three-Axis Channel T-Connects
Application:
11/259,683 →
Low expansion dielectric compositions
Application:
10/952,102 →
Flame Retardant Compositions
Application:
10/952,033 →
Three-Dimensional Module Comprised of Layers Containing Ic Chips with Overlying Interconnect Layers
Application:
10/951,990 →
Laser Cutting of Laminates for Electrical Insulation Testing
Application:
10/316,665 →
Production of Laminates for Printed Wiring Boards Using Protective Carrier
Application:
10/044,628 →
Manufacture of Prepregs and Laminates with Relatively Low Dielectric Constant for Printed Circuit Boards
Application:
10/035,975 →
Cyanate Ester Based Thermoset Compositions
Application:
09/760,125 →