Patent Assignment
Reel/Frame 018762/0087
Assignment of Assignor's Interest
Recorded: 2007-01-05
Pages: 5
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Manufacturing a Semiconductor Integrated Circuit Device That Includes Covering the Bottom of an Isolation Trench with Spin-on Glass and Etching Back the Spin-on Glass to a Predetermined Depth
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.