Patent Assignment
Reel/Frame 018769/0424
Assignment of Assignor's Interest
Recorded: 2007-01-18
Pages: 2
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Method of Designing Package for Semiconductor Device, Layout Design Tool for Performing the Same, and Method of Manufacturing Semiconductor Device Using the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.