Patent Assignment
Reel/Frame 018774/0182
Assignment of Assignor's Interest
Recorded: 2007-01-08
Received: 2007-01-16
Pages: 2
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1701 NORTH STREET, ENDICOTT, NY, 13760, UNITED STATES
Covered Property
(1)
Method of making circuitized substrate with solder balls having roughened surfaces, method of making electrical assembly including said circuitized substrate, and method of making multiple circuitized substrate assembly
Application:
11/650,520 →