IP Library Assignment 018789/0839
Patent Assignment
Reel/Frame 018789/0839

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2007-01-23 Received: 2007-01-23 Pages: 4
Assignors
KANG, TAEWOO
Executed: 2007-01-09
KIM, KYUNGOE
Executed: 2007-01-09
PENDSE, RAJENDRA D.
Executed: 2007-01-17
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Applications (2)
Solder joint flip chip interconnection
App. No. 11/640,468
SEMICONDUCTOR SYSTEM WITH SOLDER JOINT INTERCONNECT
App. No. 60/597,648