Patent Assignment
Reel/Frame 018793/0148
Assignment of Assignor's Interest
Recorded: 2007-01-23
Received: 2007-01-23
Pages: 6
Assignors
CHOI, BONGSUK
Executed: 2006-12-27
KIM, YOUNG CHEOL
Executed: 2006-12-27
SHIM, IL KWON
Executed: 2007-01-05
LEE, KOO HONG
Executed: 2007-01-23
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Property
(1)
Wafer Level Chip Scale Package System
Application:
11/618,647 →