Patent Assignment
Reel/Frame 018846/0909
Assignment of Assignor's Interest
Recorded: 2007-02-02
Pages: 3
Assignors
LEE, DONG-KI
Executed: 2007-01-26
KIM, BYUNG-UK
Executed: 2007-01-26
YOUN, HYOC-MIN
Executed: 2007-01-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Resin Composition for Organic Insulating Layer, Method of Manufacturing Resin Composition, and Display Panel Including Resin Composition
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.