Patent Assignment
Reel/Frame 018848/0462
Assignment of Assignor's Interest
Recorded: 2007-02-02
Received: 2007-02-02
Pages: 4
Assignors
CHOW, SENG GUAN
Executed: 2007-01-19
HAN, BYUNG JOON
Executed: 2007-01-19
SHIM, IL KWON
Executed: 2007-01-19
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Property
(1)
Integrated Circuit Package with Molded Cavity
Application:
11/670,714 →