Patent Assignment
Reel/Frame 018860/0215
Assignment of Assignor's Interest
Recorded: 2007-01-30
Pages: 2
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-6334, JAPAN
Covered Property
(1)
Method of manufacturing semiconductor device
Application:
11/699,568 →
Publication:
US 2007/0178623