Patent Assignment
Reel/Frame 018966/0017
Assignment of Assignor's Interest
Recorded: 2007-02-07
Pages: 2
Assignors
KIM, SEUNG WOO
Executed: 2007-02-02
LEE, JEONG HOON
Executed: 2007-02-02
LEE, JAE SUP
Executed: 2007-02-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Power Amplifier Circuit and Method for Envelope Modulation of High Frequency Signal