Patent Assignment
Reel/Frame 018969/0155
Assignment of Assignor's Interest
Recorded: 2007-01-31
Pages: 4
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property
(1)
Chip Cooling Channels Formed in Wafer Bonding Gap