Patent Assignment
Reel/Frame 018988/0258
Assignment of Assignor's Interest
Recorded: 2007-02-23
Pages: 2
Assignors
CHO, EUN HYOUNG
Executed: 2007-02-21
SUH, SUNG-DONG
Executed: 2007-02-21
SOHN, JIN-SEUNG
Executed: 2007-02-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Metal Layer Having Aperture, Method of Forming the Same, Light Delivery Module Including Metal Layer Having Aperture, and Heat Assisted Magnetic Recording Head Including the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.