Patent Assignment
Reel/Frame 019085/0039
Assignment of Assignor's Interest
Recorded: 2007-03-29
Pages: 3
Assignor
BUSCH, GEORG
Executed: 2006-10-10
Assignee
SIEMENS AKTIENGESELLSCHAFT
WITTELSBACHERPLATZ 2, MUENCHEN, 80333, GERMANY
Covered Property
(1)
Method for Producing Printed Circuit Board Structures Comprising via Holes, Electronic Device Unit, and Use of a Flexible Strip Conductor Film in This Device
Application:
11/571,590 →
Publication:
US 2007/0243422
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.