Patent Assignment
Reel/Frame 019106/0718
Assignment of Assignor's Interest
Recorded: 2007-04-03
Pages: 3
Assignee
SANDISK CORPORATION
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Method of Making Semiconductor Die Stack Having Heightened Contact for Wire Bond
Application:
11/693,654 →
Publication:
US 2008/0242076
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.