IP Library Assignment 019106/0723
Patent Assignment
Reel/Frame 019106/0723

Assignment of Assignor's Interest

Recorded: 2007-04-03 Pages: 3
Assignors
TAKIAR, HEM
Executed: 2007-03-29
BHAGATH, SHRIKAR
Executed: 2007-03-29
Assignee
SANDISK CORPORATION
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Semiconductor Die Stack Having Heightened Contact for Wire Bond
Application: 11/693,651 →
Publication: US 2008/0237887
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 14, 2016
From: SANDISK CORPORATION
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038438/0904 →
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0980 →