Patent Assignment
Reel/Frame 019138/0674
Assignment of Assignor's Interest
Recorded: 2007-03-30
Pages: 3
Assignors
LEE, TAE-WOO
Executed: 2007-03-29
PARK, JONG-JIN
Executed: 2007-03-29
KWON, O-HYUN
Executed: 2007-03-29
Assignee
SAMSUNG SDI CO., LTD., A CORP. OF THE REPUBLIC OF KOREA
575 SHIN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Conducting polymer composition, conductive film formed using the conducting polymer composition, and electronic device including the conductive film
Application:
11/729,794 →
Publication:
US 2008/0020208
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.