Patent Assignment
Reel/Frame 019278/0145
Assignment of Assignor's Interest
Recorded: 2007-04-30
Pages: 3
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Substrate Treating Method and Method of Manufacturing Semiconductor Apparatus
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 16, 2015
From: SONY CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 035430/0231 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 19, 2025
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 073635/0304 →