Patent Assignment
Reel/Frame 019288/0246
Assignment of Assignor's Interest
Recorded: 2007-05-12
Received: 2007-05-12
Pages: 22
Assignors
AKSENTON, YULIA
Executed: 2007-02-12
AVSIAN, OSHER
Executed: 2007-02-12
GRINMAN, ANDREY
Executed: 2007-02-12
HAZANOVICH, FELIX
Executed: 2007-02-12
HECHT, ILYA
Executed: 2007-02-12
OVRUTSKY, DAVID
Executed: 2007-02-12
ROSENSTEIN, CHARLES
Executed: 2007-02-12
DAYAN, AVI
Executed: 2007-02-22
NYSTROM, MICHAEL J.
Executed: 2007-04-16
OGANESIAN, VAGE
Executed: 2007-04-20
BURTZLAFF, ROBERT
Executed: 2007-05-01
HUMPSTON, GILES
Executed: 2007-05-09
Assignee
TESSERA TECHNOLOGIES HUNGARY KFT.
1126 BUDAPEST, UGOCSA U. 4/B, BUDAPEST, HUX, HUNGARY
Covered Property
(1)
Wafer level packaging to lidded chips
Application:
11/655,739 →