Patent Assignment
Reel/Frame 019309/0441
Assignment of Assignor's Interest
Recorded: 2007-05-17
Pages: 3
Assignor
HOOI, KEAN SEONG
Executed: 2005-01-20
Assignee
MOTOROLA, INC.
1303 E. ALGONQUIN ROAD, IL01-3RD FLOOR, SCHAUMBURG, ILLINOIS, 60196
Covered Property
(1)
Method and Apparatus for Reducing Stresses Applied to Bonded Interconnects Between Substrates
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 13, 2010
From: MOTOROLA, INC
To: MOTOROLA MOBILITY, INC
Reel/Frame 025673/0558 →
Change of Name
Oct 2, 2012
From: MOTOROLA MOBILITY, INC.
To: MOTOROLA MOBILITY LLC
Reel/Frame 029216/0282 →
Assignment of Assignor's Interest
Nov 21, 2014
From: MOTOROLA MOBILITY LLC
To: GOOGLE TECHNOLOGY HOLDINGS LLC
Reel/Frame 034320/0001 →