Patent Assignment
Reel/Frame 019320/0607
Assignment of Assignor's Interest
Recorded: 2007-05-21
Pages: 2
Assignors
YANASE, SHINICHIRO
Executed: 2007-04-24
KAI, HAJIME
Executed: 2007-04-24
FUNAZUKA, MAKOTO
Executed: 2007-04-24
MATSUMOTO, TOSHIAKI
Executed: 2007-04-24
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Shield substrate, semiconductor package, and semiconductor device
Application:
11/713,098 →
Publication:
US 2007/0257337
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.