Assignment of Assignor's Interest

Recorded: 2007-06-01 Pages: 2

Assignors

YAMAGUCHI, KATSUMI

Executed: 2007-02-01

NAKAJIMA, NOBUMASA

Executed: 2007-02-01

FURUKAWA, YOSHIO

Executed: 2007-02-01

Assignee

KANEKA CORPORATION

2-4, NAKANOSHIMA 3-CHOME, KITA-KU OSAKA, JAPAN

Covered Property (1)

Epoxy Resin Composition For Semiconductor Sealing Agents and Epoxy Resin Molding Material

Application: 11/660,274 →

Publication: US 2007/0251419

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.