Patent Assignment
Reel/Frame 019381/0993
Assignment of Assignor's Interest
Recorded: 2007-06-05
Pages: 2
Assignors
CHO, EUN-HYOUNG
Executed: 2007-05-28
SUH, SUNG-DONG
Executed: 2007-05-28
SOHN, JIN-SEUNG
Executed: 2007-05-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Bending Waveguide, Method of Fabricating the Bending Waveguide, Light Delivery Module Employing the Bending Waveguide, and Heat Assisted Magnetic Recording Head Employing the Bending Waveguide
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SEAGATE TECHNOLOGY INTERNATIONAL
Reel/Frame 028153/0689 →
Corrective Assignment to Correct the Remove Erroneously Filed No. 7255478 from Schedule Previously Recorded at Reel: 028153 Frame: 0689. Assignor(S) Hereby Confirms the Assignment.
Oct 5, 2016
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 040001/0920 →