IP Library › Assignment 019404/0424
Patent Assignment
Reel/Frame 019404/0424

Assignment of Assignor's Interest

Recorded: 2007-06-08 Pages: 6
Assignors
YU, CHEEMEN
Executed: 2007-06-05
LIAO, CHIH-CHIN
Executed: 2007-06-05
TAKIAR, HEM
Executed: 2007-06-05
Assignee
SANDISK CORPORATION
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Method of Reducing Warpage in Semiconductor Molded Panel
Application: 11/759,475 →
Publication: US 2008/0305576
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 14, 2016
From: SANDISK CORPORATION
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038438/0904 →
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0980 →