Patent Assignment
Reel/Frame 019443/0581
Assignment of Assignor's Interest
Recorded: 2007-06-11
Pages: 5
Assignors
LE BRIZ, OLIVIER
Executed: 2007-03-09
MARSANNE, SEBASTIEN
Executed: 2007-03-09
MARTIN, LAURENCE
Executed: 2007-03-15
CROCE, GUISEPPE
Executed: 2007-03-14
Assignees
STMICROELECTRONICS S.A.
29, BOULEVARD ROMAIN ROLLAND, 92120 MONTROUGE, FRANCE
STMICROELECTRONICS S.R.L.
VIA OLIVETTI 2, AGRATE BRIANZA, 20041, ITALY
Covered Property
(1)
Integrated-Circuit Chip with Offset External Pads and Method for Fabricating Such a Chip
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 26, 2016
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS INTERNATIONAL NV
Reel/Frame 037841/0686 →
Assignment of Assignor's Interest
Feb 26, 2016
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL NV
Reel/Frame 037841/0162 →
Assignment of Assignor's Interest
Jun 23, 2016
From: STMICROELECTRONICS INTERNATIONAL NV
To: FRANCE BREVETS
Reel/Frame 039140/0584 →
Assignment of Assignor's Interest
May 23, 2022
From: FRANCE BREVETS
To: MICROELECTRONIC INNOVATIONS, LLC
Reel/Frame 060161/0346 →
Corrective Assignment to Correct the the Assignee Address Previously Recorded at Reel: 060161 Frame: 0346. Assignor(S) Hereby Confirms the Assignment.
Jun 16, 2022
From: FRANCE BREVETS
To: MICROELECTRONIC INNOVATIONS, LLC
Reel/Frame 060389/0768 →