Patent Assignment
Reel/Frame 019549/0972
Assignment of Assignor's Interest
Recorded: 2007-07-12
Pages: 4
Assignors
SHIMOOSAKO, KANJI
Executed: 2007-05-10
ITO, TAKASHI
Executed: 2007-05-10
TANAKA, SHIGERU
Executed: 2007-05-10
NISHINAKA, MASARU
Executed: 2007-05-10
MURAKAMI, MUTSUAKI
Executed: 2007-05-10
Assignee
KANEKA CORPORATION
2-4, NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI OSAKA, 530-8288, JAPAN
Covered Property
(1)
Plating Target Material, Polyamic Solution And Polyimide Resin Solution Which Are Used To Form The Plating Target Material, And Printed-Wiring Board Using THem
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.