Patent Assignment
Reel/Frame 019582/0644
Assignment of Assignor's Interest
Recorded: 2007-07-20
Pages: 3
Assignors
RUDMANN, HARTMUT
Executed: 2007-07-09
HEIMGARTNER, STEPHAN
Executed: 2007-07-09
ROSSI, MARKUS
Executed: 2007-07-03
Assignee
HEPTAGON OY
TEKNIIKANTIE 12, ESPOO, FI-02150, FINLAND
Covered Property
(1)
Method of Producing a Wafer Scale Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 18, 2012
From: HEPTAGON OY
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 028574/0208 →
Change of Name
Feb 8, 2019
From: HEPTAGON MICRO OPTICS PTE. LTD.
To: AMS SENSORS SINGAPORE PTE. LTD.
Reel/Frame 048289/0147 →
Change of Name
Nov 3, 2025
From: AMS SENSORS SINGAPORE PTE. LTD.
To: AMS-OSRAM ASIA PACIFIC PTE. LTD.
Reel/Frame 073476/0659 →