Patent Assignment
Reel/Frame 019695/0196
Assignment of Assignor's Interest
Recorded: 2007-08-02
Pages: 3
Assignor
EUN, HYUNG-LAE
Executed: 2007-07-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Chip Package Having a Stacked Plurality of Different Sized Semiconductor Chips, and Method of Manufacturing the Same