Patent Assignment
Reel/Frame 019712/0105
Assignment of Assignor's Interest
Recorded: 2007-08-17
Pages: 3
Assignors
LUBOMIRSKY, DMITRY
Executed: 2007-06-27
NEMANI, SRINIVAS D.
Executed: 2007-06-27
YIEH, ELLIE
Executed: 2007-07-24
Assignee
APPLIED MATERIALS, INC.
P. O. BOX 450A, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Dielectric Deposition and Etch Back Processes for Bottom Up Gapfill