Patent Assignment
Reel/Frame 019778/0868
Assignment of Assignor's Interest
Recorded: 2007-09-04
Pages: 2
Assignors
HIRANO, TOSHIKI
Executed: 2007-07-17
TAKAHASHI, HARUHIDE
Executed: 2007-07-18
TSUCHIYA, TATSUMI
Executed: 2007-07-17
Assignee
HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
LOCATELLIKADE 1, PARNASSUSTOREN, AMSTERDAM, 1076 AZ, NETHERLANDS
Covered Property
(1)
Thermally Insulating Bonding Pad Structure for Solder Reflow Connection
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Docket Number to Be Changed to HSJ920070027US1 Previously Recorded on Reel 019778 Frame 0868. Assignor(S) Hereby Confirms the Assignment.
Sep 11, 2007
From: HIRANO, TOSHIKI; TAKAHASHI, HARUHIDE; TSUCHIYA, TATSUMI
To: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
Reel/Frame 019810/0645 →
Change of Name
Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
Assignment of Assignor's Interest
Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040821/0550 →
Security Interest
Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
Release of Security Interest at Reel 052915 Frame 0566
Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
Patent Collateral Agreement - a&R Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
Patent Collateral Agreement - Ddtl Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →