Patent Assignment
Reel/Frame 019779/0640
Assignment of Assignor's Interest
Recorded: 2007-09-04
Pages: 4
Assignors
HIEW, SIEW S.
Executed: 2007-07-27
NI, JIM C.
Executed: 2007-07-27
LEE, CHARLES C.
Executed: 2007-07-27
YU, I-KANG
Executed: 2007-07-27
SHEN, MING-SHIANG
Executed: 2007-08-23
Assignee
SUPER TALENT ELECTRONICS, INC.
2079 NORTH CAPITOL AVENUE, SAN JOSE, CALIFORNIA, 95132
Covered Property
(1)
Molding Methods to Manufacture Single-Chip Chip-on-Board Usb Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.