Patent Assignment
Reel/Frame 019816/0072
Assignment of Assignor's Interest
Recorded: 2007-09-12
Pages: 2
Assignors
INAO, HISAHO
Executed: 2007-02-15
HIRANO, TATSUYA
Executed: 2007-02-15
SHIMIZU, KATSUTOSHI
Executed: 2007-03-01
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Semiconductor Package and Production Method Thereof, and Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 14, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021835/0421 →
Lien
Jan 13, 2014
From: COLLABO INNOVATIONS, INC.
To: PANASONIC CORPORATION
Reel/Frame 031997/0445 →
Assignment of Assignor's Interest
May 26, 2014
From: PANASONIC CORPORATION
To: COLLABO INNOVATIONS, INC.
Reel/Frame 033021/0806 →