Assignment of Assignor's Interest

Recorded: 2007-09-12 Received: 2007-09-12 Pages: 4

Assignors

YU, CHEEMEN

Executed: 2007-08-16

LEE, MING HSUN

Executed: 2007-09-04

Assignee

SANDISK CORPORATION

601 MCCARTHY BOULEVARD, MILPITAS, CA, 95035, UNITED STATES

Covered Property (1)

Stacked memory chip packages utilizing greater overlap between upper package leads and lower package leads

Application: 11/769,149 →