Patent Assignment
Reel/Frame 019819/0185
Assignment of Assignor's Interest
Recorded: 2007-09-12
Pages: 4
Assignee
SANDISK CORPORATION
601 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Method of Multi-Chip Packaging in a Tsop Package
Application:
11/769,158 →
Publication:
US 2009/0004774
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.